Chemical Vapor Deposition For Microelectronics: Principles, Technology And Applications (materials Science And Process Technology)

CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES Editors Rointan F. Bunshah, University of California, Los Angeles (Materials Science and Technology) Gary E. McGuire, Microelectronics Center of North Carolina (Electronic Materials and Processing) DEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS; Developments and Applications: by Rointan F. Bunshah et al CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS; Principles, Technology, and Applications: by Arthur Sherman SEMICONDUCTOR MATERIALS AND PROCESS TECHNOLOGY HANDBOOK; Very Large Scale Integrated Circuits (VLSIC) and Ultra Large Scale Integrated Circuits (ULSIC): edited by Gary E. McGuire SOL-GEL TECHNOLOGY; edited by Lisa C. Klein Principles, Developments and Applications: HYBRID MICROCIRCUIT TECHNOLOGY HANDBOOK; Materials, Processes, Design, Testing and Production: by James J. Licari and Leonard R. Enlow HANDBOOK OF THIN FILM DEPOSITION PROCESSES AND TECHN IOU ES; Principles, Methods, Equipment and Applications: edited by Klaus K. Schuegraf Related Titles ADHESIVES TECHNOLOGY HANDBOOK: by Arthur H. Landrock HANDBOOK OF THERMOSEl PLASTICS: edited by Sidney H. Goodman HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS; Principles, Applications and Technology: edited by Donald L. Tolliver CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS Principles, Technology, and Applications by Arthur Sherman Varian Research Center Palo Alto, California Reprint Edition ~ NOYES PUBLICATIONS np -Westwood, New Jersey, U.S.A. Copyright © 1987 by Arthur Sherman No part of this book may be reproduced in any form without permission in writing from the Publisher. Library of Congress Catalog Card Number: 87-11277 ISBN: 0-8155-1136-1 Printed in the United States Published in the United States of America by Noyes Publications Fairview Avenue, Westwood, New Jersey 07675 10 9 Library of Congress Cataloging-in-Publication Data Sherman, Arthur. Chemical vapor deposition for microelectronics. Bibliography: p. Includes index. 1. Vapor-plating. 2. Integrated circuits--Design and construction. I. Title. TS695.S54 1987 621.381'7 87-11277 ISBN 0-8155-1136-1 Preface The objective of the present text on Chemical Vapor Deposition (CVD) is to present a unified picture of an interdiscipl inary field. There are many references that deal in great detail with limited aspects of the subject, but none that encompass all elements. For example, early CVD reactors tended to operate at atmospheric pressures, and many researchers studied the fluid dynamic nature of such systems (recirculating flows, buoyancy effects, etc.). Recently, low pressure systems have become of interest, and by and large, the fluid dynamic character of the reactor flow is not studied in detail. Such an approach is acceptable for initial operation of these systems. However, as demands on them continue to grow, it becomes necessary to again consider the fluid dynamics. Similarly, many cold-wall as well as hot-wall reactor systems have been used commercially. Again, as these systems are pushed to their limits, it becomes apparent that there are fundamental differences in their operation. It is doubtful that such differences will be clarified until researchers include fluid dynamics with gas phase kinetics and with surface kinetics in their studies. To summarize,