E-Book Overview
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. • Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. • As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries. • Covers processes and equipment, as well as new materials and changes required for the surface conditioning process. • Editors are two of the top names in the field and are both extensively published. • Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol.
E-Book Content
Handbook of Silicon Wafer Cleaning Technology
Handbook of Silicon Wafer Cleaning Technology Second Edition Edited by
Karen A. Reinhardt Cameo Consulting San Jose, California USA
Werner Kern Werner Kern and Associates Lakewood, New Jersey USA
Copyright © 2008 by William Andrew Inc. No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Cataloging-in-Publication Data Handbook of silicon wafer cleaning technology / edited by Karen A. Reinhardt, Werner Kern. — 2nd ed. p. cm. ISBN 978-0-8155-1554-8 (978-0-8155) 1. Silicon-on-insulator technology. I. Reinhardt, Karen A. II. Kern, Werner, 1925TK7871.85.H338 2007 621.3815’2–dc22 2007037151 Printed in the United States of America This book is printed on acid-free paper. 10 9 8 7 6 5 4 3 2 1 Published by: William Andrew Inc. 13 Eaton Avenue Norwich, NY 13815 1-800-932-7045 www.williamandrew.com NOTICE To the best of our knowledge the information in this publication is accurate; however the Publisher does not assume any responsibility or liability for the accuracy or completeness of, or consequences arising from, such information. This book is intended for informational purposes only. Mention of trade names or commercial products does not constitute endorsement or recommendation for their use by the Publisher. Final determination of the suitability of any information or product for any use, and the manner of that use, is the sole responsibility of the user. Anyone intending to rely upon any recommendation of materials or procedures mentioned in this publication should be independently satisfied as to such suitability, and must meet all applicable safety and health standards.
Contents
Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .