Advanced Thermal Design Of Electronic Equipment

E-Book Overview

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther­ mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat­ ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli­ cation of advanced thermal management techniques requires a background in fluid dynamics.


E-Book Content

Advanced Thermal Electronic Equipment Join Us on the Internet WWW http://www.thomson.com EAAAIL: [email protected] thomson.com is the on-line portal for the products, services and resources available from International Thomson Publishing (ITP). This Internet kiosk gives users immediate access to more than 34 ITP publishers and over 20,000 products. Through thomson.com Internet users can search catalogs, examine subject-specific resource centers and subscribe to electronic discussion lists. You can purchase ITP products from your local bookseller, or directly through thomson.com. Visit Chapman & Hall's Internet Resource Center for information on our new publications, links to useful sites on the World Wide Web and an opportunity to join our e-mail mailins list. Point your browserto:http://www.chaphall.com or http://www.thomsonxom/chaphall/electeng.html for Electrical Engineering A service of l(X)P Advanced Thermal Electronic Equipment R A L P H R E M S B U R G President Electronic Packaging Associates, Inc. Sarasota, Florida ES I(T)P SPRINGER-SCIENCE+BUSINESS MEDIA, B.V. INTERNATIONAL THOMSON PUBLISHING Thomson Science New York • Albany • Bonn • Boston • Cincinnati • Detroit London • Madrid • Melbourne • Mexico City • Pacific Grove Paris • San Francisco • Singapore • Tokyo • Toronto • Washington Photo courtesy of Scott Oliphant Cover design: Curtis Tow Graphics Copyright © 1998 by Springer Science+Business Media Dordrecht Originally published by Chapman & Hall in 1998 Softcover r e p r i n t of the hardcover 1st edition 1998 A l l rights reserved. No part of this book covered by the copyright hereon may be reproduced or used in any form or by any means—graphic, electronic, or mechanical, including photocopying, recording, taping, or information storage and retrieval systems—without the written permission of the publisher. 1 2 3 4 5 6 7 8 9 10 XXX 01 00 99 98 Library of Congress Cataloging-in-Publication Data Remsburg, Ralph. Advanced thermal design of electronic equipment
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