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A concise, comprehensive overview of sputter deposition technology?a key technology for materials research in the next decade. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production and for metallurgical coatings. High temperature superconductors can be synthesized with sputtering under non-equilibrium conditions. Diamond films and ferroelectric materials are other applications.
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HANDBOOK OF SPUTTER DEPOSITION TECHNOLOGY HANDBOOK OF SPUTTER DEPOSITION TECHNOLOGY Principles, Technology and Applications Reprint Edition by Kiyotaka Wasa Matsushita Electric Industrial Co., Ltd. Osaka, Japan Shigeru Hayakawa Ion Engineering Center Corporation Osaka, Japan NOYES PUBLICATIONS Westwood, New Jersey, U.S.A. Copyright © 1992 by Noyes Publications No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 90-27820 ISBN: 0-8155-1280-5 Printed in the United States Published in the United States of America by Noyes Publications Fairview Avenue, Westwood, New Jersey 07675 109876 Library of Congress Cataloging-in-Publication Data Wasa, Kiyotaka. Handbook of sputter deposition technology: principles, technology, and applications / by Kiyotaka Wasa and Shigeru Hayakawa. p. cm. Includes bibliographical references and index. ISBN 0-8155-1280-5 : 1. Cathode sputtering (Plating process) 2. Thin films. I. Hayakawa, Shigeru, 1925- . II. Title. 1991 TS695.W37 621.3815'2--dc20 90-27820 CIP MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES Editors Rointan F. Bunshah, University of California, Los Angeles (Series Editor) Gary E. McGuire, Microelectronics Center of North Carolina (Series Editor) Stephen M. Rossnagel, IBM Thomas J. Watson Research Center (Consulting Editor) Electronic Materials and Process Technology DEPOSITION TECHNOLOGIES FOR ALMS AND COATINGS: by Rointan F. Bunshah et al CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman SEMICONDUCTOR MATERIAlS AND PROCESS TECHNOLOGY HANDBOOK: edited by Gary E. McGuire HYBRID MICROCIRCUIT TECHNOLOGY HANDBOOK: by James J. Licari and Leonard R. Enlow HANDBOOK OF THIN FILM DEPOSITION PROCESSESANDTECHNIOUES: edited by Klaus K. Schuegraf IONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIAlS: edited by Devendra Gupta and Paul S. Ho HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by Donald L. Tolliver HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY: edited by Jerome J. Cuomo, Stephen M. Rossnagel, and Harold R. Kaufman CHARACTERIZATION OF SEMICONDUCTOR MATERIALS-Volume 1: edited by Gary E. McGuire HANDBOOK OF PLASMA PROCESSING TECHNOLOGY: edited by Stephen M. Rossnagel, Jerome J. Cuomo, and William D. Westwood HANDBOOK OF SEMICONDUCTOR SIUCON TECHNOLOGY: edited by William C. O'Mara, Robert B. Herring, and Lee P. Hunt HANDBOOK OF POLYMER COATINGS FOR ELECTRONICS: by James J. Licari and Laura A. Hughes HANDBOOK OF SPUTTER DEPOSITION TECHNOLOGY: by Kiyotaka Wasa and Shigeru Hayakawa HANDBOOK OF VLSI MICROLITHOGRAPHY: edited by William B. Glendinning and John N. Helbert CHEMISTRY OF SUPERCONDUCTOR MATERIAlS: edited by Terrell A. Vanderah CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SIUCIDES: by John E.J. Schmitz (continued) v VI Series Ceramic and Other Materials-Processing and Technology SOL-GEL TECHNOLOGY FOR THIN ALMS, FIBERS, PREFORMS, ELECTRONICS AND SPECIAlTY SHAPES: edited by Lisa C. Klein ABER REINFORCED CERAMIC COMPOSrrES: by K.S. Mazdiyasni ADVANCED CERAMIC PROCESSING AND TECHNOLOGY-Volume