MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.
MEMS Materials and Processes Handbook
MEMS Reference Shelf Series Editors: Stephen D. Senturia Professor of Electrical Engineering, Emeritus Massachusetts Institute of Technology Cambridge, Massachusetts Antonio J. Ricco Small Satellite Division NASA Ames Research Center Moffett Field, California
For other titles in this series, go to: www.springer.com/series/7724
Roger T. Howe Professor Department of Electrical Engineering Stanford University Stanford, California
Reza Ghodssi · Pinyen Lin Editors
MEMS Materials and Processes Handbook
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Editors Reza Ghodssi Department of Electrical and Computer Engineering Institute for Systems Research MEMS Sensors and Actuators Laboratory University of Maryland College Park, Maryland USA
[email protected]
Pinyen Lin Touch Micro-system Technology Corp. Taoyuan Taiwan and Walsin Lihwa Corporation Taipei Taiwan
[email protected]
ISSN 1936-4407 ISBN 978-0-387-47316-1 e-ISBN 978-0-387-47318-5 DOI 10.1007/978-0-387-47318-5 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2011921730 © Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer soft-ware, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Foreword
The field that is affectionately known as “MEMS” (an acronym for Micro-ElectroMechanical Systems) is a descendant of the integrated circuits industry, but a descendent that has developed in ways and directions never anticipated by its parent. Now a highly specialized discipline in its own right, MEMS draws not only on all of convent