E-Book Overview
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings??including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered??including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
E-Book Content
HANDBOOK OF VLSI MICROLITHOGRAPHY SECOND EDITION Principles, Technology, and Applications
JMR
30-Nov-00
JMR- 30-Nov-00
HANDBOOK OF VLSI MICROLITHOGRAPHY SECOND EDITION Principles, Technology, and Applications
Edited by
John N. Helbert Motorola, Inc. Phoenix, Arizona
NOYES PUBLICATIONS Park Ridge, New Jersey, U.S.A. WILLIAM ANDREW PUBLISHING, LLC Norwich, New York, U.S.A.
JMR
30-Nov-00
Copyright © 2001 by Noyes Publications No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 00-028173 ISBN: 0-8155-1444-1 Printed in the United States Published in the United States of America by Noyes Publications / William Andrew Publishing, LLC 13 Eaton Avenue Norwich, NY 13815 1-800-932-7045 www.knovel.com 10 9 8 7 6 5 4 3 2 1
Library of Congress Cataloging-in-Publication Data
Handbook of VLSI Microlithography / [edited] by John Helbert.--2nd edition p. cm. Includes bibliographical references and index. ISBN 0-8155-1444-1 1. Integrated circuits--Very large scale integration. 2. Microlithography. I. Helbert, John N. TK7874 .H3494 2001 621.3815'31--dc21
00-028173 CIP
MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES Series Editors Rointan F. Bunshah, University of California, Los Angeles Gary E. McGuire, Microelectronics Center of North Carolina Stephen M. Rossnagel, IBM Thomas J. Watson Research Center
Electronic Materials and Process Technology CHARACTERIZATION OF SEMICONDUCTOR MATERIALS, Volume 1: edited by Gary E. McGuire CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SILICIDES: by John E. J. Schmitz CHEMISTRY OF SUPERCONDUCTOR MATERIALS: edited by Terrell A. Vanderah CONTACTS TO SEMICONDUCTORS: edited by Leonard J. Brillson DIAMOND CHEMICAL VAPOR DEPOSITION: by Huimin Liu and David S. Dandy DIAMOND FILMS AND COATINGS: edited by Robert F. Davis DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS: